Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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Issue Dt:
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06/05/2018
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Application #:
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14958928
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Filing Dt:
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12/03/2015
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Publication #:
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Pub Dt:
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07/14/2016
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Inventors:
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Jae Choon KIM, Donghan KIM, Jikho SONG, Mitsuo UMEMOTO, Inho CHOI
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Title:
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SEMICONDUCTOR PACKAGES WITH HEAT DISSIPATION LAYERS AND PILLARS AND METHODS FOR FABRICATING THE SAME
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| 129, SAMSUNG-RO, YEONGTONG-GU |
| SUWON-SI, GYEONGGI-DO, KOREA, REPUBLIC OF 443-742 |
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| RENAISSANCE IP LAW GROUP LLP (PIP) |
| 9600 SW OAK STREET, SUITE 560 |
| PORTLAND, OR 97223 |
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