Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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Issue Dt:
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09/26/2017
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Application #:
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14927199
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Filing Dt:
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10/29/2015
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Publication #:
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Pub Dt:
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07/28/2016
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Inventors:
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Hongjie WANG, Feng CHEN, Peng SUN, Yibo LIU, Dongkai SHANGGUAN
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Title:
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METHOD OF MANUFACTURING FAN OUT WAFER LEVEL PACKAGE
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| NO. 200 LINGHU BLVD. |
| BLDG. D1, CHINA SR. NETWORK INT. INNOVATION PARK |
| WUXI, JIANGSU PROVINCE, CHINA 214135 |
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| FLENER IP LAW |
| 300 W. ADAMS ST |
| SUITE 840 |
| CHICAGO, IL 60606 |
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