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Patent Assignment Abstract of Title
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Total Assignments: 2
Patent #:
Issue Dt:
08/07/2018
Application #:
15006693
Filing Dt:
01/26/2016
Publication #:
Pub Dt:
07/28/2016
Inventors:
Parviz TAYEBATI, Bien CHANN, Robin HUANG, Michael DEUTSCH
Title:
SOLDER-CREEP MANAGEMENT IN HIGH-POWER LASER DEVICES
Assignment: 1
Reel/Frame:
038266/0364Recorded: 04/13/2016Pages: 7
Conveyance:
ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Assignors:
Exec Dt:
04/11/2016
Exec Dt:
04/07/2016
Exec Dt:
04/07/2016
Exec Dt:
04/08/2016
Assignee:
30 UPTON DRIVE
WILMINGTON, MASSACHUSETTS 01887
Correspondent:
HELEN SAMSON
TERADIODE, INC.
30 UPTON DRIVE
WILMINGTON, MA 01887
Assignment: 2
Reel/Frame:
063311/0881Recorded: 04/13/2023Pages: 4
Conveyance:
MERGER (SEE DOCUMENT FOR DETAILS).
Assignor:
Exec Dt:
03/22/2023
Assignee:
TWO RIVERFRONT PLAZA
NEWARK, NEW JERSEY 07102
Correspondent:
MORGAN, LEWIS, & BOCKIUS LLP (B0)
1701 MARKET STREET
PHILADELPHIA, PA 19103

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