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Patent Assignment Abstract of Title
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Total Assignments: 1
Patent #:
Issue Dt:
11/28/2017
Application #:
15022170
Filing Dt:
03/15/2016
Publication #:
Pub Dt:
08/04/2016
Inventors:
Naoto Nishida, Seiji Yamaguchi, Akira Yoshida, Satoshi Shimmatsu
Title:
THERMALLY CONDUCTIVE FILLER AND THERMALLY CONDUCTIVE RESIN COMPOSITION CONTAINING SAME
Assignment: 1
Reel/Frame:
038124/0557Recorded: 03/29/2016Pages: 4
Conveyance:
ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Assignors:
Exec Dt:
03/17/2016
Exec Dt:
03/17/2016
Exec Dt:
03/17/2016
Exec Dt:
03/17/2016
Assignee:
1985, OAZA KOGUSHI
UBE-SHI, YAMAGUCHI, JAPAN 755-8510
Correspondent:
WESTERMAN, HATTORI, DANIELS AND ADRIAN
1250 CONNECTICUT AVENUE, NW
SUITE 700
WASHINGTON, DC 20036

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