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Patent Assignment Abstract of Title
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Total Assignments: 1
Patent #:
NONE
Issue Dt:
Application #:
15095483
Filing Dt:
04/11/2016
Publication #:
Pub Dt:
08/04/2016
Inventors:
Yang Du, Karim Arabi
Title:
METHODS FOR CONSTRUCTING THREE DIMENSIONAL (3D) INTEGRATED CIRCUITS (ICs) (3DICs) AND RELATED SYSTEMS
Assignment: 1
Reel/Frame:
038244/0378Recorded: 04/11/2016Pages: 3
Conveyance:
ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Assignors:
Exec Dt:
06/04/2014
Exec Dt:
06/05/2014
Assignee:
5775 MOREHOUSE DRIVE
SAN DIEGO, CALIFORNIA 92121
Correspondent:
W&T/QUALCOMM
106 PINEDALE SPRINGS WAY
CARY, NC 27511

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