Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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NONE
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Issue Dt:
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Application #:
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14611173
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Filing Dt:
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01/31/2015
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Publication #:
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Pub Dt:
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08/04/2016
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Inventors:
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Wei-Te WANG, Chi-Yuan Hsiao, Yao-Sheng GUO
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Title:
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COOLING MODULE AND HEAT SINK
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| NO.9, ALLEY 19, LANE 20, TA HSING RD. LUCHU SHIANG, |
| TAOYUAN HSIEN, TAIWAN 338 |
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| HDLS IPR SERVICES |
| P.O. BOX 230970 |
| CENTREVILLE, VA 20120 |
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