Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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Issue Dt:
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05/02/2017
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Application #:
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14759227
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Filing Dt:
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07/05/2015
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Publication #:
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Pub Dt:
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08/25/2016
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Inventor:
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Hong Lin
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Title:
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METHOD FOR PROCESSING AN ELECTROPLATED COPPER FILM IN COPPER INTERCONNECT PROCESS
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| 497 GAOSI ROAD, ZHANGJIANG HIGH-TECH PARK, PUDONG |
| SHANGHAI, CHINA 201210 |
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| SHANGHAI IC R&D CENTER CO., LTD |
| 497 GAOSI ROAD, ZHANGJIANG HIGH-TECH PARK, PUDONG |
| SHANGHAI, 201210 CHINA |
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