Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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Issue Dt:
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11/20/2018
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Application #:
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15160618
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Filing Dt:
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05/20/2016
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Publication #:
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Pub Dt:
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09/15/2016
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Inventors:
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Chih-Fei Lee, Fu-Cheng Chang, Chi-Cherng Jeng, Hsin-Chi Chen, Yuan-Ko Hwang
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Title:
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Method of Forming Redistribution Layer
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| NO. 8, LI-HSIN RD. 6 |
| SCIENCE-BASED INDUSTRIAL PARK |
| HSINCHU, TAIWAN 300 |
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| SERVILLA WHITNEY LLC |
| 33 WOOD AVENUE SOUTH |
| SUITE 830 |
| ISELIN, NJ 08830 |
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