Patent Assignment Abstract of Title
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Total Assignments:
2
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Patent #:
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Issue Dt:
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02/28/2017
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Application #:
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14659172
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Filing Dt:
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03/16/2015
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Publication #:
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Pub Dt:
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09/22/2016
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Inventors:
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Qinglong ZHANG, John Hon Shing LAU, Ming LI, Michael ZAHN, Yiu Ming CHEUNG
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Title:
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THERMALLY-ENHANCED PROVISION OF UNDERFILL TO ELECTRONIC DEVICES USING A STENCIL
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| 2 YISHUN AVENUE 7 |
| SINGAPORE, SINGAPORE 768924 |
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| OSTROLENK FABER LLP |
| 1180 AVENUE OF THE AMERICAS |
| NEW YORK, NY 10036 |
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Assignment:
2
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CHANGE OF NAME (SEE DOCUMENT FOR DETAILS).
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| 2 YISHUN AVENUE 7 |
| SINGAPORE, SINGAPORE 768924 |
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| CPA GLOBAL |
| CASTLE STREET , LIBERATION HOUSE |
| ST HELIER, JERSEY, JE1 1BL JERSEY |
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