Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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NONE
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Issue Dt:
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Application #:
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14395102
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Filing Dt:
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10/17/2014
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Publication #:
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Pub Dt:
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09/22/2016
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Inventors:
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Wen-Jung Chuang, Xing-Bao Chen
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Title:
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Package of LED Chip and Manufacturing Method Thereof
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| 2F., BUILDING B, NO. 6101 |
| LONGDONG AVENUE, PUDONG |
| SHANGHAI, CHINA |
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| ROOM 402, NO. 18, LANE 555 |
| JIJING ROAD, PUDONG |
| SHANGHAI, CHINA |
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| 2F., BUILDING B, NO. 6101 |
| LONGDONG AVENUE, PUDONG |
| SHANGHAI, CHINA |
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| DANIEL R. MCCLURE |
| 3100 INTERSTATE NORTH CIRCLE |
| SUITE 150 |
| ATLANTA, GA 30339 |
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