Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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NONE
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Issue Dt:
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Application #:
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14856418
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Filing Dt:
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09/16/2015
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Publication #:
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Pub Dt:
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10/06/2016
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Inventors:
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Daeik Daniel Kim, Changhan Hobie Yun, Je-Hsiung Jeffrey Lan, Mario Francisco Velez et al
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Title:
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SILICON-ON-INSULATOR (SOI) WAFERS EMPLOYING MOLDED SUBSTRATES TO IMPROVE INSULATION AND REDUCE CURRENT LEAKAGE
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| 5775 MOREHOUSE DRIVE |
| SAN DIEGO, CALIFORNIA 92121 |
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| W&T/QUALCOMM |
| 2530 MERIDIAN PARKWAY |
| SUITE 300 |
| DURHAM, NC 27713 |
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