Patent Assignment Abstract of Title
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Total Assignments:
2
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Patent #:
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Issue Dt:
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07/04/2017
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Application #:
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14442570
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Filing Dt:
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05/13/2015
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Publication #:
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Pub Dt:
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10/06/2016
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Inventors:
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Satoshi TANIMOTO, Shinji SATO, Hidekazu TANISAWA, Kohei MATSUI
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Title:
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AU-BASED SOLDER DIE ATTACHMENT SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING THE SAME
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| 2, TAKARA-CHO, KANAGAWA-KU |
| YOKOHAMA-SHI, KANAGAWA, JAPAN 221-0023 |
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| 6-3, KITMO 3-CHOME |
| NIIZA-SHI, SAITAMA, JAPAN 352-8666 |
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| 1-1, TANABESHINDEN, KAWASAKI-KU |
| KAWASAKI-SHI, KANAGAWA, JAPAN 210-9530 |
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| GLENN LAW |
| FOLEY & LARDNER LLP SUITE 500 |
| 3000 K STREET, N.W. |
| WASHINGTON, DC 20007-5143 |
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Assignment:
2
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| 1-1, TANABESHINDEN, KAWASAKI-KU |
| KAWASAKI-SHI, KANAGAWA, JAPAN 210-9530 |
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| FOLEY AND LARDNER LLP SUITE 500 |
| 3000 K STREET NW |
| WASHINGTON, DC 20007 |
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