Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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Issue Dt:
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08/07/2018
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Application #:
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15078793
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Filing Dt:
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03/23/2016
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Publication #:
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Pub Dt:
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10/06/2016
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Inventors:
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Masashi MIYAZAKI, Masashi KATAKAI, Yuichi SUGIYAMA, Yutaka HATA
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Title:
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Embedded Component Substrate with a Metal Core Layer having an Open Cavity and Pad Electrodes at the Bottom of the Cavity
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| 16-20, UENO 6-CHOME, TAITO-KU |
| TOKYO, JAPAN 110-0005 |
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| MASAO YOSHIMURA, CHEN YOSHIMURA LLP |
| 2975 SCOTT BLVD. |
| SUITE 110 |
| SANTA CLARA, CA 95054 |
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