Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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NONE
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Issue Dt:
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Application #:
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15071192
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Filing Dt:
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03/15/2016
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Publication #:
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Pub Dt:
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10/06/2016
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Inventors:
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HIROKI TAMIYA, KOJI KISHINO, RYUJI TAKAHASHI, YASUNORI HOSHINO, TAKAHIRO YAMADA et al
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Title:
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THERMOSETTING RESIN COMPOSITION, METAL-CLAD LAMINATED PLATE, INSULATING SHEET, PRINTED WIRING BOARD, METHOD OF MANUFACTURING PRINTED WIRING BOARD, AND PACKAGE SUBSTRATE
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| 1-61, SHIROMI 2-CHOME, CHUO-KU, OSAKA-SHI |
| OSAKA, JAPAN 540-6207 |
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| PANASONIC IP MANAGEMENT CO., LTD. |
| 7F OBP PANASONIC TOWER |
| 1-61, SHIROMI 2-CHOME, CHUO-KU |
| OSAKA, 540-6207 JAPAN |
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