Patent Assignment Abstract of Title
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Total Assignments:
2
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Patent #:
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Issue Dt:
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04/09/2019
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Application #:
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14655688
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Filing Dt:
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06/25/2015
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Publication #:
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Pub Dt:
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10/06/2016
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Inventors:
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Chuan Hu, Johanna Swan, Chia-Pin Chiu
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Title:
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MULTI-CHIP-MODULE SEMICONDUCTOR CHIP PACKAGE HAVING DENSE PACKAGE WIRING
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| 2200 MISSION COLLEGE BOULEVARD |
| SANTA CLARA, CALIFORNIA 95054 |
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| BLAKELY SOKOLOFF TAYLOR & ZAFMAN |
| C/O CPA GLOBAL |
| P.O. BOX 52050 |
| MINNEAPOLIS, MN 55402 |
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Assignment:
2
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| 2200 MISSION COLLEGE BOULEVARD |
| SANTA CLARA, CALIFORNIA 95054 |
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| BLAKELY SOKOLOFF TAYLOR & ZAFMAN LLP |
| 1279 OAKMEAD PARYWAY |
| SUNNYVALE, CA 94085 |
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