Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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Issue Dt:
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11/07/2017
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Application #:
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15101270
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Filing Dt:
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06/02/2016
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Publication #:
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Pub Dt:
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10/20/2016
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Inventors:
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Syoji Ubukata, Shusuke Yoshihara, Kazuaki Matsumoto
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Title:
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HIGHLY-THERMALLY-CONDUCTIVE RESIN COMPOSITION, AND RESIN MATERIAL FOR HEAT DISSIPATION/HEAT TRANSFER AND THERMALLY CONDUCTIVE FILM COMPRISING SAME
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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3-18, NAKANOSHIMA 2-CHOME |
KITA-KU, OSAKA-SHI |
OSAKA, JAPAN 5308288 |
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LDLK&M |
600 SOUTH AVENUE WEST |
WESTFIELD, NJ 07090 |
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