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Patent Assignment Abstract of Title
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Total Assignments: 2
Patent #:
Issue Dt:
05/14/2019
Application #:
15191848
Filing Dt:
06/24/2016
Publication #:
Pub Dt:
10/20/2016
Inventors:
Won-Jun Lee, Jae-Min Park
Title:
COPPER METAL FILM, METHOD FOR PREPARING THE SAME, AND METHOD FOR FORMING COPPER INTERCONNECT FOR SEMICONDUCTOR DEVICE USING THE SAME
Assignment: 1
Reel/Frame:
039003/0505Recorded: 06/24/2016Pages: 4
Conveyance:
ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Assignors:
Exec Dt:
06/21/2016
Exec Dt:
06/21/2016
Assignee:
(CHILGOE-DONG), 81, SANDAN-RO 197BEON-GIL
PYEONGTAEK-SI, GYEONGGI-DO, KOREA, REPUBLIC OF 17749
Correspondent:
GREER, BURNS & CRAIN, LTD
300 S. WACKER DR.
SUITE 2500
CHICAGO, IL 60606
Assignment: 2
Reel/Frame:
059671/0175Recorded: 04/21/2022Pages: 5
Conveyance:
LICENSE (SEE DOCUMENT FOR DETAILS).
Assignor:
Exec Dt:
01/02/2022
Assignee:
JINGXI NORTH ROAD, YIXING ECONOMIC DEVELOPMENT ZONE
YIXING CITY, JIANGSU PROVINCE, CHINA 214203
Correspondent:
DENTONS US LLP
1900 K STREET NW
WASHINGTON, DC 20006

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