Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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Issue Dt:
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03/05/2019
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Application #:
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15215658
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Filing Dt:
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07/21/2016
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Publication #:
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Pub Dt:
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11/10/2016
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Inventors:
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Paul S. Andry, Russell A. Budd, Bing Dang, Li-Wen Hung, John U. Knickerbocker et al
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Title:
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Double Layer Release Temporary Bond and Debond Processes and Systems
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| NEW ORCHARD ROAD |
| ARMONK, NEW YORK 10504 |
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| HARRINGTON & SMITH |
| 4 RESEARCH DRIVE, SUITE 202 |
| SHELTON, CT 06484-6212 |
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