Patent Assignment Abstract of Title
NOTE:Results display only for issued patents and published applications.
For pending or abandoned applications please consult USPTO staff.
|
Total Assignments:
1
|
|
Patent #:
|
|
Issue Dt:
|
09/18/2018
|
Application #:
|
15064545
|
Filing Dt:
|
03/08/2016
|
|
Publication #:
|
|
Pub Dt:
|
11/10/2016
| | | | |
|
Inventors:
|
Ching-Wen Hsiao, Tzu-Hung Lin, I-Hsuan Peng, Tung-Hsien Hsieh, Sheng-Ming Chang
|
|
Title:
|
SEMICONDUCTOR CHIP PACKAGE ASSEMBLY WITH IMPROVED HEAT DISSIPATION PERFORMANCE
|
|
|
Assignment:
1
|
|
|
|
|
|
|
ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
|
|
|
|
|
|
|
|
|
| NO. 1, DUSING RD. 1ST, SCIENCE-BASED INDUSTRIAL PARK |
| HSIN-CHU, TAIWAN |
|
|
|
|
| WINSTON HSU |
| P.O.BOX 506 |
| MERRIFIELD, VA 22116 |
|
|
Search Results as of:
05/28/2024 06:40 AM
If you have any comments or questions concerning the data displayed,
contact
PRD / Assignments at 571-272-3350. v.2.6
Web interface last modified:
August 25, 2017 v.2.6
|
