Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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Issue Dt:
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10/17/2017
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Application #:
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14809710
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Filing Dt:
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07/27/2015
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Publication #:
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Pub Dt:
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11/10/2016
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Inventors:
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Seung Taek YANG, Sang Eun LEE
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Title:
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PACKAGE-ON-PACKAGE TYPE SEMICONDUCTOR DEVICE WHICH IS REALIZED THROUGH APPLYING NOT A TSV TECHNOLOGY BUT A FAN-OUT WAFER LEVEL PACKAGE TECHNOLOGY
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| 2091, GYEONGCHUNG-DAERO, BUBAL-EUB |
| ICHEON-SI GYEONGGI-DO, KOREA, REPUBLIC OF |
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| WILLIAM PARK & ASSOCIATES LTD. |
| 930 N. YORK ROAD, SUITE 201 |
| HINSDALE, IL 60521 |
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