Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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Issue Dt:
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05/16/2017
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Application #:
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15220294
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Filing Dt:
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07/26/2016
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Publication #:
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Pub Dt:
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11/17/2016
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Inventors:
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CHIH-YUAN CHEN, TIEN-YU LEE
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Title:
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LED PACKAGE STRUCTURE
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| NO.88, YANGHU ROAD, WUJIN HI-TECH INDUSTRIAL DEVELOPMENT ZONE |
| CHANGZHOU CITY,JIANGSU PROVINCE, CHINA |
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| 22F., NO. 392, RUEY KUANG ROAD, NEIHU DIST. |
| TAIPEI CITY, TAIWAN |
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| LI&CAI INTELLECTUAL PROPERTY(USA) OFFICE |
| 3057 NUTLEY STREET |
| SUITE 818 |
| FAIRFAX, VA 22031 |
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