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Patent Assignment Abstract of Title
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Total Assignments: 2
Patent #:
10199337
Issue Dt:
02/05/2019
Application #:
15144162
Filing Dt:
05/02/2016
Publication #:
20160338202
Pub Dt:
11/17/2016
Inventors:
Han KIM, Jung Ho SHIM, Dae Hyun PARK, Kang Heon HUR, Young Gwan KO
Title:
ELECTRONIC COMPONENT PACKAGE AND METHOD OF MANUFACTURING THE SAME
Assignment: 1
Reel/Frame:
038437/0090Recorded: 05/02/2016Pages: 5
Conveyance:
ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Assignors:
PARK, DAE HYUN
Exec Dt:
04/15/2016
KIM, HAN
Exec Dt:
04/15/2016
HUR, KANG HEON
Exec Dt:
04/15/2016
KO, YOUNG GWAN
Exec Dt:
04/15/2016
SHIM, JUNG HO
Exec Dt:
04/15/2016
Assignee:
SAMSUNG ELECTRO-MECHANICS CO., LTD.
MAEYOUNG-RO 150 (MAETAN-DONG)
YOUNGTONG-GU
SUWON-SI, GYEONGGI-DO, KOREA, REPUBLIC OF
Correspondent:
MCDERMOTT WILL & EMERY LLP
THE MCDERMOTT BUILDING
500 NORTH CAPITOL STREET, N.W.
WASHINGTON, DC 20001
Assignment: 2
Reel/Frame:
049350/0756Recorded: 06/03/2019Pages: 8
Conveyance:
ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Assignor:
SAMSUNG ELECTRO-MECHANICS CO., LTD.
Exec Dt:
06/01/2019
Assignee:
SAMSUNG ELECTRONICS CO., LTD.
129, SAMSUNG-RO, YEONGTONG-GU
SUWON-SI, GYEONGGI-DO, KOREA, REPUBLIC OF
Correspondent:
MORGAN LEWIS & BOCKIUS LLP
1111 PENNSYLVANIA AVENUE, NW
WASHINGTON, DC 20004

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