Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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Issue Dt:
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01/16/2018
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Application #:
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15243971
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Filing Dt:
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08/23/2016
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Publication #:
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Pub Dt:
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12/08/2016
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Inventors:
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Takafumi YAMADA, Ryoichi KATO, Hiromichi GOHARA
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Title:
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SEMICONDUCTOR MODULE HAVING A SOLDER-BONDED COOLING UNIT
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| 1-1, TANABESHINDEN, KAWASAKI-KU |
| KAWASAKI-SHI |
| KANAGAWA, JAPAN 210-9530 |
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| RYUKA IP LAW FIRM |
| 1-6-1 SHINJUKU L TOWER 22ND FLOOR |
| NISHI-SHINJUKU, SHINJUKU-KU |
| TOKYO, 163-1522 JAPAN |
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