Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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Issue Dt:
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06/13/2017
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Application #:
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14730171
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Filing Dt:
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06/03/2015
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Publication #:
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Pub Dt:
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12/08/2016
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Inventors:
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Jun Zhai, Flynn P. Carson, Kwan-Yu Lai, Kunzhong Hu
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Title:
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DUAL MOLDED STACK TSV PACKAGE
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| 1 INFINITE LOOP |
| CUPERTINO, CALIFORNIA 95014 |
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| APPLE INC./BSTZ BLAKELY SOKOLOFF TAYLOR |
| 1279 OAKMEAD PARKWAY |
| SUNNYVALE, CA 94085-4040 |
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