Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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Issue Dt:
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09/19/2017
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Application #:
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15120937
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Filing Dt:
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08/23/2016
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Publication #:
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Pub Dt:
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12/22/2016
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Inventors:
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Atsushi Irisawa, Rie Wada
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Title:
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Lead-Free Solder Alloy, Solder Material and Joined Structure
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| 32-1, SENJU-ASAHI-CHO, ADACHI-KU |
| TOKYO, JAPAN 120-0026 |
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| THE WEBB LAW FIRM, P.C. |
| ONE GATEWAY CENTER |
| 420 FT. DUQUESNE BLVD, SUITE 1200 |
| PITTSBURGH, PA 15222 |
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