Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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Issue Dt:
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05/23/2017
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Application #:
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14940167
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Filing Dt:
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11/13/2015
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Publication #:
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Pub Dt:
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12/22/2016
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Inventors:
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Jen-Yi Chen, Chun-Chieh Wang, Chao-Sen Chang, Yung-Shiang Chang
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Title:
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MEMS CHIP PACKAGE
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| 50, MEIBAO RD, DALANG, LONGHUA NEW DISTRICT, SHENZHEN , |
| GUANGDONG, CHINA |
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| JIANQ CHYUN INTELLECTUAL PROPERTY OFFICE |
| 7F.-1, NO. 100, ROOSEVELT RD., SEC. 2, |
| TAIPEI, 100 TAIWAN |
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