Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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Issue Dt:
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02/11/2020
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Application #:
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15259734
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Filing Dt:
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09/08/2016
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Publication #:
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Pub Dt:
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12/29/2016
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Inventors:
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Masahiro KOSUGI, Toshikazu OKUBO
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Title:
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ELECTROLYTIC COPPER PLATING SOLUTION ANALYZER, AND ELECTROLYTIC COPPER PLATING SOLUTION ANALYSIS METHOD
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| 5-1, TAITO 1-CHOME, TAITO-KU |
| TOKYO, JAPAN 110-0016 |
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| FOLEY & LARDNER LLP |
| 3000 K STREET, N.W. |
| SUITE 600 |
| WASHINGTON, DC 20007 |
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