Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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NONE
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Issue Dt:
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Application #:
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15104273
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Filing Dt:
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06/14/2016
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Publication #:
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Pub Dt:
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01/05/2017
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Inventors:
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Hideyuki KOYANAGI, Hisae OBA, Satoshi EBIHARA, Takehisa YANE, Masami HAMANO, Kouji OKANO
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Title:
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ADHESIVE COMPOSITION USING POLYAMIDE-IMIDE RESIN
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| 2-8, DOJIMA HAMA 2-CHOME, KITA-KU, OSAKA-SHI |
| OSAKA, JAPAN 530-8230 |
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| 1-12-15, SHIBA-DAIMON, MINATO-KU |
| TOKYO, JAPAN 105-8585 |
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| WENDEROTH, LIND & PONACK, L.L.P. |
| 1030 15TH STREET, N.W. |
| SUITE 400 EAST |
| WASHINGTON, DC 20005 |
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