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Patent Assignment Abstract of Title
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Total Assignments: 1
Patent #:
Issue Dt:
06/27/2017
Application #:
14820422
Filing Dt:
08/06/2015
Publication #:
Pub Dt:
02/09/2017
Inventors:
David Benjaminson, Dmitry Lubomirsky, Shubham Chourey, Ananda Seelavanth Math et al
Title:
BOLTED WAFER CHUCK THERMAL MANAGEMENT SYSTEMS AND METHODS FOR WAFER PROCESSING SYSTEMS
Assignment: 1
Reel/Frame:
036610/0929Recorded: 09/21/2015Pages: 8
Conveyance:
ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Assignors:
Exec Dt:
08/19/2015
Exec Dt:
08/20/2015
Exec Dt:
08/24/2015
Exec Dt:
08/24/2015
Exec Dt:
09/16/2015
Assignee:
3050 BOWERS AVENUE
SANTA CLARA, CALIFORNIA 95054
Correspondent:
EUGENE J. BERNARD
KILPATRICK TOWNSEND & STOCKTON LLP
TWO EMBARCADERO CENTER - 8TH FLOOR
SAN FRANCISCO, CA 94111

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