Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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Issue Dt:
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10/29/2019
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Application #:
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15304452
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Filing Dt:
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10/14/2016
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Publication #:
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Pub Dt:
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02/09/2017
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Inventors:
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Kenji MEGURO, Shinichiro YAGI, Taishi WAKABAYASHI, Masatake NAKANO, Tomosuke YOSHIDA
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Title:
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METHOD FOR MANUFACTURING A BONDED SOI WAFER
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| 2-1, OHTEMACHI 2-CHOME, CHIYODA-KU |
| TOKYO, JAPAN |
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| AARON L. WEBB |
| OLIFF PLC |
| P.O. BOX 320850 |
| ALEXANDRIA, VA 22320-4850 |
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