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Patent Assignment Abstract of Title
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Total Assignments: 2
Patent #:
9984979
Issue Dt:
05/29/2018
Application #:
15297831
Filing Dt:
10/19/2016
Publication #:
20170040265
Pub Dt:
02/09/2017
Inventors:
Dae Hyun PARK, Han KIM, Kang Heon HUR, Young Gwan KO, Jung Ho SHIM
Title:
FAN-OUT SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SAME
Assignment: 1
Reel/Frame:
040066/0643Recorded: 10/19/2016Pages: 5
Conveyance:
ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Assignors:
PARK, DAE HYUN
Exec Dt:
10/13/2016
KIM, HAN
Exec Dt:
10/13/2016
HUR, KANG HEON
Exec Dt:
10/13/2016
KO, YOUNG GWAN
Exec Dt:
10/13/2016
SHIM, JUNG HO
Exec Dt:
10/13/2016
Assignee:
SAMSUNG ELECTRO-MECHANICS CO., LTD.
MAEYOUNG-RO 150 (MAETAN-DONG)
YOUNGTONG-GU
SUWON-SI, GYEONGGI-DO, KOREA, REPUBLIC OF
Correspondent:
MCDERMOTT WILL & EMERY LLP
THE MCDERMOTT BUILDING
500 NORTH CAPITOL STREET, N.W.
WASHINGTON, DC 20001
Assignment: 2
Reel/Frame:
049350/0756Recorded: 06/03/2019Pages: 8
Conveyance:
ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Assignor:
SAMSUNG ELECTRO-MECHANICS CO., LTD.
Exec Dt:
06/01/2019
Assignee:
SAMSUNG ELECTRONICS CO., LTD.
129, SAMSUNG-RO, YEONGTONG-GU
SUWON-SI, GYEONGGI-DO, KOREA, REPUBLIC OF
Correspondent:
MORGAN LEWIS & BOCKIUS LLP
1111 PENNSYLVANIA AVENUE, NW
WASHINGTON, DC 20004

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