Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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Issue Dt:
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01/16/2018
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Application #:
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15306303
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Filing Dt:
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10/24/2016
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Publication #:
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Pub Dt:
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02/16/2017
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Inventors:
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Akira YAMAUCHI, Tadatomo SUGA
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Title:
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SUBSTRATE BONDING APPARATUS AND SUBSTRATE BONDING METHOD
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| 3-6-3, HIGASHINAKANO, NAKANO-KU |
| TOKYO, JAPAN 164-0003 |
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| 77, ISHIHARANISHIMACHI, KISSHOIN, MINAMI-KU |
| KYOTO-SHI, KYOTO, JAPAN 601-8366 |
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| OSTROLENK FABER LLP |
| 1180 AVENUE OF THE AMERICAS |
| NEW YORK, NY 10036 |
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