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Patent Assignment Abstract of Title
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Total Assignments: 1
Patent #:
9978661
Issue Dt:
05/22/2018
Application #:
15235958
Filing Dt:
08/12/2016
Publication #:
20170047264
Pub Dt:
02/16/2017
Inventors:
YUNHYEOK IM, OLEG FEYGENSON, JUNGSU HA, YOUNGBAE KIM, JICHUL KIM, SANG IL KIM, SEUNGKON MOK
Title:
PACKAGED SEMICONDUCTOR CHIPS HAVING HEAT DISSIPATION LAYERS AND GROUND CONTACTS THEREIN
Assignment: 1
Reel/Frame:
039452/0574Recorded: 08/16/2016Pages: 10
Conveyance:
ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Assignors:
IM, YUNHYEOK
Exec Dt:
04/14/2016
FEYGENSON, OLEG
Exec Dt:
04/18/2016
KIM, SANG IL
Exec Dt:
04/21/2016
KIM, YOUNGBAE
Exec Dt:
04/20/2016
KIM, JICHUL
Exec Dt:
04/20/2016
MOK, SEUNGKON
Exec Dt:
04/20/2016
HA, JUNGSU
Exec Dt:
04/18/2016
Assignee:
SAMSUNG ELECTRONICS CO., LTD.
129, SAMSUNG-RO
YEONGTONG-GU, SUWON-SI,
GYEONGGI-DO, KOREA, REPUBLIC OF 16677
Correspondent:
SUSAN E. FREEDMAN
MYERS BIGEL & SIBLEY, P.A.
PO BOX 37428
RALEIGH, NC 27627

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