Patent Assignment Abstract of Title
NOTE:Results display only for issued patents and published applications.
For pending or abandoned applications please consult USPTO staff.
|
Total Assignments:
1
|
|
Patent #:
|
|
Issue Dt:
|
10/16/2018
|
Application #:
|
15246432
|
Filing Dt:
|
08/24/2016
|
|
Publication #:
|
|
Pub Dt:
|
03/02/2017
| | | | |
|
Inventors:
|
Hyun Hak JUNG, Eun Dong KIM, Jong Won LEE, Jai Kyoung CHOI, Byeong Ho JEONG
|
|
Title:
|
METHOD OF MANUFACTURING FAN-OUT TYPE WAFER LEVEL PACKAGE
|
|
|
Assignment:
1
|
|
|
|
|
|
|
ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
|
|
|
|
|
|
|
|
|
| 16, BAEKSEOKGONGDAN 7-RO, SEOBUK-GU |
| CHEONAN-SI, CHUNGCHEONGNAM-DO, KOREA, REPUBLIC OF 31094 |
|
|
|
|
| RENAISSANCE IP LAW GROUP LLP (PIP) |
| 9600 SW OAK ST. SUITE 560 |
| PORTLAND, OR 97223 |
|
|
Search Results as of:
05/05/2024 01:47 PM
If you have any comments or questions concerning the data displayed,
contact
PRD / Assignments at 571-272-3350. v.2.6
Web interface last modified:
August 25, 2017 v.2.6
|
