Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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Issue Dt:
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04/17/2018
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Application #:
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15356174
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Filing Dt:
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11/18/2016
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Publication #:
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Pub Dt:
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03/09/2017
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Inventors:
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Ching-Chen HAO, Chih-Hung LU
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Title:
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INTEGRATED CIRCUIT WITH A SIDEWALL LAYER AND AN ULTRA-THICK METAL LAYER AND METHOD OF MAKING
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| NO. 8, LI-HSIN RD. VI, HSINCHU SCIENCE PARK |
| HSINCHU, TAIWAN 300-77 |
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| HAYNES AND BOONE, LLP IP SECTION |
| 2323 VICTORY AVENUE |
| SUITE 700 |
| DALLAS, TX 75219 |
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