Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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NONE
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Issue Dt:
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Application #:
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15257770
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Filing Dt:
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09/06/2016
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Publication #:
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Pub Dt:
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03/09/2017
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Inventors:
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BONG WOO CHOI, SUNGSOO KIM, HYUNGSANG PARK, JIWON JANG
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Title:
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INTEGRATED CIRCUIT PACKAGING SYSTEM WITH SINGLE-LAYER SUPPORT STRUCTURE
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| 10 ANG MO KIO STREET 65 |
| #04-08/09 TECHPOINT |
| SINGAPORE, SINGAPORE 569059 |
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| WONG & REES LLP |
| 4340 STEVENS CREEK BLVD. |
| SUITE 106 |
| SAN JOSE, CA 95129 |
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