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Patent Assignment Abstract of Title
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Total Assignments: 2
Patent #:
10208488
Issue Dt:
02/19/2019
Application #:
15264655
Filing Dt:
09/14/2016
Publication #:
20170073978
Pub Dt:
03/16/2017
Inventors:
Hartmut Schneider, Freyja Eberle, Steffen Köhler, Peter Csatary, Herbert Blaschitz
Title:
Processing Facility for Manufacturing Integrated Circuits from Semiconductor Wafers as well as Perforated Panel for a Processing Facility
Assignment: 1
Reel/Frame:
040419/0714Recorded: 11/27/2016Pages: 12
Conveyance:
ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Assignors:
SCHNEIDER, HARTMUT
Exec Dt:
10/10/2016
EBERLE, FREYJA
Exec Dt:
10/10/2016
KÖHLER, STEFFEN
Exec Dt:
10/10/2016
CSATARY, PETER
Exec Dt:
10/10/2016
BLASCHITZ, HERBERT
Exec Dt:
10/10/2016
Assignee:
M+W GROUP GMBH
LOTTERBERGSTR. 30
STUTTGART, GERMANY 70499
Correspondent:
GUDRUN E. HUCKETT DRAUDT
SCHUBERTSTR. 15A
WUPPERTAL, 42289 GERMANY
Assignment: 2
Reel/Frame:
057603/0239Recorded: 09/27/2021Pages: 3
Conveyance:
ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Assignor:
M+W GROUP GMBH
Exec Dt:
08/16/2021
Assignee:
EXYTE MANAGEMENT GMBH
LÖWENTORBOGEN 9B
STUTTGART, GERMANY 70376
Correspondent:
GUDRUN E. HUCKETT DRAUDT
SCHUBERTSTR. 15A
WUPPERTAL, 42289 GERMANY

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