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Patent Assignment Abstract of Title
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Total Assignments: 1
Patent #:
9978521
Issue Dt:
05/22/2018
Application #:
15265268
Filing Dt:
09/14/2016
Publication #:
20170076867
Pub Dt:
03/16/2017
Inventors:
Keisuke OKAI, Makoto ENDO, Hiroshi SHINDO, Yui SUGIURA, Tomomichi GUNJI, Yohei NODA et al
Title:
MULTILAYER ELECTRONIC COMPONENT
Assignment: 1
Reel/Frame:
039740/0785Recorded: 09/14/2016Pages: 4
Conveyance:
ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Assignors:
OKAI, KEISUKE
Exec Dt:
08/03/2016
ENDO, MAKOTO
Exec Dt:
08/25/2016
SHINDO, HIROSHI
Exec Dt:
08/17/2016
SUGIURA, YUI
Exec Dt:
08/10/2016
GUNJI, TOMOMICHI
Exec Dt:
08/17/2016
NODA, YOHEI
Exec Dt:
08/04/2016
TANAKA, HIROBUMI
Exec Dt:
08/04/2016
Assignee:
TDK CORPORATION
3-9-1, SHIBAURA, MINATO-KU
TOKYO, JAPAN 108-0023
Correspondent:
JAMES A. OLIFF
OLIFF PLC
P.O. BOX 320850
ALEXANDRIA, VA 22320-4850

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