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Patent Assignment Abstract of Title
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Total Assignments: 3
Patent #:
Issue Dt:
08/22/2017
Application #:
14862564
Filing Dt:
09/23/2015
Publication #:
Pub Dt:
03/23/2017
Inventors:
Masao Noguchi, Shailesh Joshi, Ercan Mehmet Dede
Title:
Systems Of Bonded Substrates and Methods For Bonding Substrates
Assignment: 1
Reel/Frame:
036635/0169Recorded: 09/23/2015Pages: 3
Conveyance:
ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Assignors:
Exec Dt:
09/08/2015
Exec Dt:
09/08/2015
Exec Dt:
09/08/2015
Assignee:
25 ATANTIC AVENUE
ERLANGER, KENTUCKY 41018
Correspondent:
DINSMORE & SHOHL LLP
255 EAST FIFTH STREET, SUITE 1900
CINCINNATI, OH 45202
Assignment: 2
Reel/Frame:
043857/0334Recorded: 10/13/2017Pages: 2
Conveyance:
ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Assignor:
Exec Dt:
10/09/2017
Assignee:
1, TOYOTA-CHO
TOYOTA-SHI
AICHI-KEN, JAPAN 471-8571
Correspondent:
DINSMORE & SHOHL LLP
255 EAST FIFTH STREET
SUITE 1900
CINCINNATI, OH 45202
Assignment: 3
Reel/Frame:
052280/0207Recorded: 04/01/2020Pages: 7
Conveyance:
ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Assignor:
Exec Dt:
12/24/2019
Assignee:
1-1 SHOWA-CHO
KARIYA-CITY, AICHI-PREF, JAPAN 448-8661
Correspondent:
DINSMORE & SHOHL LLP
900 WILSHIRE DRIVE, SUITE 300
TROY, MI 48084

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