Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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Issue Dt:
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01/28/2020
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Application #:
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15307763
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Filing Dt:
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10/28/2016
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Publication #:
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Pub Dt:
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03/23/2017
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Inventors:
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Kenichi FUJIKAWA, Yoshiharu HATAKEYAMA, Miho YAMAGUCHI, Yuji YAMAGISHI, Akihiro OOHASHI
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Title:
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THERMALLY CONDUCTIVE POLYMER COMPOSITION AND THERMALLY CONDUCTIVE MOLDED OBJECT
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| 1-2, SHIMOHOZUMI 1-CHOME |
| IBARAKI-SHI, OSAKA, JAPAN 567-8680 |
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| 110-1-1, FUNAYOSE, MARUOKA-CHO |
| SAKAI-SHI, FUKUI, JAPAN 910-0381 |
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| SUGHRUE-265550 |
| 2100 PENNSYLVANIA AVE. NW |
| SUITE 800 |
| WASHINGTON, DC 20037-3213 |
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