Patent Assignment Abstract of Title
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Total Assignments:
2
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Patent #:
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NONE
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Issue Dt:
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Application #:
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15312622
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Filing Dt:
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11/18/2016
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Publication #:
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Pub Dt:
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03/23/2017
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Inventors:
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Masahiro Hoshino, Lenian Zhang
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Title:
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A SILICON CARBIDE SEMICONDUCTOR MODULE FOR THERMAL APPLICATION
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| NO.3 BUILDING, NO.818 KAIFA ROAD |
| TAIZHOU CITY, ZHEJIANG, CHINA 318000 |
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| NO.906, ASAHI SQUARE, AOKI 4-27-26 |
| KAWAGUCHI, SAITAMA, JAPAN 332-0031 |
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| MINDER LAW GROUP |
| 11209 NATIONAL BLVD UNIT 419 |
| LOS ANGELES, CA 90064 |
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Assignment:
2
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| NO.3 BUILDING NO.818 |
| KAIFA ROAD |
| TAIZHOU CITY, ZHEJIANG, CHINA 318000 |
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| ASPIRE IP, LLC |
| 6 N. TEJON ST. |
| SUITE 400 |
| COLORADO SPRINGS, CO 80903 |
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