Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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Issue Dt:
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05/02/2017
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Application #:
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14744382
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Filing Dt:
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06/19/2015
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Publication #:
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Pub Dt:
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03/23/2017
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Inventor:
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Timothy M. DRESSER
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Title:
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DENSE OUT OF PLANE INTERCONNECT INSIDE HERMETICALLY SEALED MODULES
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| P.O. BOX 868 |
| NHQ1-719 |
| NASHUA, NEW HAMPSHIRE 03061-0868 |
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| BAE SYSTEMS |
| PO BOX 868 |
| NHQ1-719 |
| NASHUA, NH 03061-0868 |
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