Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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Issue Dt:
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06/12/2018
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Application #:
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14902548
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Filing Dt:
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12/31/2015
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Publication #:
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Pub Dt:
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03/30/2017
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Inventor:
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Kosuke IKEDA
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Title:
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Power Semiconductor Module for Improved Thermal Performance
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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2-1, OHTEMACHI 2-CHOME, CHIYODA-KU |
TOKYO, JAPAN 100-0004 |
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LADAS & PARRY LLP |
5670 WILSHIRE BLVD. |
SUITE 2100 |
LOS ANGELES, CA 90036-5679 |
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