Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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Issue Dt:
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03/14/2017
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Application #:
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14867463
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Filing Dt:
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09/28/2015
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Publication #:
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Pub Dt:
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03/30/2017
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Inventor:
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Dinesh PATIL
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Title:
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MULTI-LEVEL SIGNALING FOR ON-PACKAGE CHIP-TO-CHIP INTERCONNECT THROUGH SILICON BRIDGE
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| 101 INNOVATION DRIVE |
| SAN JOSE, CALIFORNIA 95134 |
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| OKAMOTO & BENEDICTO LLP |
| P.O. BOX 641330 |
| SAN JOSE, CA 95164-1330 |
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