Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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NONE
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Issue Dt:
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Application #:
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15127936
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Filing Dt:
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09/21/2016
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Publication #:
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Pub Dt:
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04/06/2017
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Inventor:
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Takashi MURAYAMA
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Title:
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PACKING FOR SUBSTRATE PLATING JIG AND SUBSTRATE PLATING JIG USING THE SAME
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| TIXTOWER UENO 16TH FLOOR, 8-1, HIGASHIUENO 4-CHOME, TAITO-KU |
| TOKYO, JAPAN 110-0015 |
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| OBLON, ET AL. |
| 1940 DUKE STREET |
| ALEXANDRIA, VA 22314 |
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