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Patent Assignment Abstract of Title
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Total Assignments: 1
Patent #:
Issue Dt:
02/14/2023
Application #:
14877980
Filing Dt:
10/08/2015
Publication #:
Pub Dt:
04/13/2017
Inventors:
Eric M. Rehder, Xiaobo Zhang, Joseph C. Boisvert, Peichen Pien
Title:
SEMICONDUCTOR DEVICE INCLUDING AN ELECTRICALLY CONDUCTIVE ADHESIVE LAYER AND A BYPASS DIODE IN A CARRIER
Assignment: 1
Reel/Frame:
036765/0777Recorded: 10/09/2015Pages: 4
Conveyance:
ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Assignors:
Exec Dt:
10/05/2015
Exec Dt:
10/05/2015
Exec Dt:
10/06/2015
Exec Dt:
10/05/2015
Assignee:
100 NORTH RIVERSIDE PLAZA
CHICAGO, ILLINOIS 60606-1596
Correspondent:
STEFAN B. BLUM
10050 INNOVATION DRIVE
SUITE 400
DAYTON, OH 45342-4934

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