Patent Assignment Abstract of Title
NOTE:Results display only for issued patents and published applications.
For pending or abandoned applications please consult USPTO staff.
|
Total Assignments:
1
|
|
Patent #:
|
|
Issue Dt:
|
12/25/2018
|
Application #:
|
14919378
|
Filing Dt:
|
10/21/2015
|
|
Publication #:
|
|
Pub Dt:
|
04/27/2017
| | | | |
|
Inventors:
|
Chen-Hua YU, Ming-Fa CHEN, Sung-Feng YEH
|
|
Title:
|
STRUCTURE AND FORMATION METHOD FOR CHIP PACKAGE
|
|
|
Assignment:
1
|
|
|
|
|
|
|
ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
|
|
|
|
|
|
|
|
|
| NO. 8, LI-HSIN RD. 6, HSINCHU SCIENCE PARK |
| HSINCHU, TAIWAN 300-78 |
|
|
|
|
| BIRCH, STEWART, KOLASCH & BIRCH, LLP |
| P.O. BOX 747 |
| FALLS CHURCH, VA 22040-0747 |
|
|
Search Results as of:
05/15/2024 05:17 PM
If you have any comments or questions concerning the data displayed,
contact
PRD / Assignments at 571-272-3350. v.2.6
Web interface last modified:
August 25, 2017 v.2.6
|
