Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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Issue Dt:
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10/24/2017
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Application #:
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15297782
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Filing Dt:
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10/19/2016
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Publication #:
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Pub Dt:
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05/04/2017
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Inventors:
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HIROSHI TOMIZAWA, KATSUYA FUKASE
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Title:
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CORELESS WIRING SUBSTRATE HAVING AN INSULATION LAYER WITH A BULGED COVERING PORTION AND SEMICONDUCTOR DEVICE THEREOF
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| 80, OSHIMADA-MACHI, NAGANO-SHI |
| NAGANO-KEN, JAPAN 381-2287 |
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| TAROLLI, SUNDHEIM, COVELL & TUMMINO L.L. |
| 1300 EAST NINTH STREET, SUITE 1700 |
| CLEVELAND, OH 44114 |
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