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Patent Assignment Abstract of Title
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Total Assignments: 2
Patent #:
Issue Dt:
12/10/2019
Application #:
15311787
Filing Dt:
11/16/2016
Publication #:
Pub Dt:
05/04/2017
Inventors:
Tae Hyuck KIM, Tae Hwan ROH, Yoonhee LEE, Jin Kyu LEE, Junhee JUNG
Title:
BATTERY MODULE HAVING MOLDING PART FOR INSULATING
Assignment: 1
Reel/Frame:
050292/0049Recorded: 09/06/2019Pages: 8
Conveyance:
ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Assignors:
Exec Dt:
08/24/2017
Exec Dt:
08/23/2017
Exec Dt:
09/05/2017
Exec Dt:
08/23/2017
Exec Dt:
09/11/2017
Assignee:
128, YEOUI-DAERO, YEONGDEUNGPO-GU
SEOUL, KOREA, REPUBLIC OF 07336
Correspondent:
MORGAN LEWIS & BOCKIUS
1111 PENNSYLVANIA AVENUE, NW​
WASHINGTON, DC 20004
Assignment: 2
Reel/Frame:
058295/0068Recorded: 11/04/2021Pages: 225
Conveyance:
ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Assignor:
Exec Dt:
10/27/2021
Assignee:
PARC. 1, TOWER ONE
108 YEOUI-DAERO, YEONGDEUNGPO-GU
SEOUL, KOREA, REPUBLIC OF 07335
Correspondent:
DENTONS US LLP
1900 K STREET NW
WASHINGTON, DC 20006

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