Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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Issue Dt:
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10/29/2019
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Application #:
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15330572
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Filing Dt:
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10/13/2016
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Publication #:
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Pub Dt:
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05/11/2017
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Inventor:
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Wei Li
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Title:
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Apparatus and method for modelling a modular multilevel converter in an electronic simulator
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| 1751, RUE RICHARDSON |
| BUREAU #1060 |
| MONTRÉAL, QUÉBEC, CANADA H3K 1G6 |
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| ROTHWELL, FIGG, ERNST & MANBECK, P.C. |
| 901 NEW YORK AVENUE, N.W. |
| SUITE 900 EAST |
| WASHINGTON, DC 20001 |
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